Metrology and Inspection
Metrology & Inspection tools play a vital role in semiconductor manufacturing. By measuring critical dimensions and detecting defects, they ensure precision and accuracy throughout the production process.
High-precision Measurement
Metrology tools measure critical dimensions, enabling near-real-time adjustments that enhance process control and improve yields. They may ensure precise control over 3D structures, and film uniformity while analyzing vertical layer stacking for optimal interconnection.
Inspection tools detect a wide variety of defect types, including particle contamination, voids & delaminations, pattern misalignment, and structural defects in advanced node devices. These systems analyze wafers at multiple process stages, identifying surface imperfections or buried defects to anticipate electrical anomalies that could impact device performance.
As semiconductor architectures evolve deeper into 3D designs, heterogeneous integration and more complex advanced packaging technologies, Metrology and Inspection tools become even more vital. By characterizing materials and calibrating process equipment, Metrology and Inspection techniques are able to identify opportunities for yield improvement, ultimately lowering production costs. This comprehensive approach enhances the yield and reliability of next-generation semiconductor devices, driving innovation in the industry.
Comprehensive Metrology & Inspection Solutions
-
TMAP
ExploreRevolutionizes precision with tailored, automated, and future-ready solutions for manufacturing excellence.
-
LightSpeed
ExploreOffers state-of-the-art un-patterned defect inspection, providing high flexibility for various applications.
-
PSD
ExploreElevates wafer topography and defect control through advanced Metro-Spection technology.
-
WOTAN
ExploreDelivers a unique AOI solution with full-color optics and simultaneous dual-sided inspection capabilities.
-
EDGE
ExploreMaximizes efficiency with a comprehensive edge inspection module.
-
AXIOSPECT
ExploreFunctions as the ultimate microscope and review station for inspection and metrology, featuring Zeiss optics integration.
What we offer
Optical metrology and inspection solutions are essential in semiconductor manufacturing, ensuring precision and accuracy throughout the production process.
Metrology tools measure critical dimensions like depths, step-heights, thicknesses, and other critical parameters, enabling real-time adjustments that enhance process control – while Inspection tools detect a wide variety of defect types.
By characterizing materials and equipment process quality and accuracy, Metrology and Inspection tools help our customers by:
- Improving yield
- Speeding-up time to market for new types of chips
- Lowering production costs
Our Portfolio
Our Metrology and Inspection solutions extend beyond only traditional Silicon semiconductor substrates to include specialized wafers like GaN, GaAs, InP, Glass, Sapphire and SiC, making our technology applicable across a broad range of applications, from microelectronics to power electronics and optoelectronics.
Our focus areas encompass:
- Advanced packaging
- Heterogeneous integration
- Integrated optics
Metrology
- Innovative optical interferometry for non-contact optical measurement with a focus on Heterogeneous Integration.
- Highly flexible and multi capability equipment that provides full stack metrology measurements including precise X+Y+Z dimensions, surface topography, thickness variation & trench/via depths.
Light analysis used to measure three dimensional structures to increase yields.
Metro-Spection & Inspection
- High-end innovative solutions for defect inspection of HBM-die-stacks and un-patterned wafers, including transparent substrates like glass carriers, Sapphire and SiC wafers.
- Full wafer non-contact inspection platforms applying advanced optical acquisition techniques & image processing algorithms to detect delamination, buried voids, slip-lines, particles, pits, and many other defect types.
Light analysis used to identify the widest range of defect types to increase yields.
Cutting-edge Technology
Our Metrology and Inspection solutions are needed to enable technologies that are crucial for AI modules such as:
- Through-Silicon-Via (TSV) creation
- High-Bandwidth-Memory (HBM) chip stacking
- Wafer-to-wafer / die-to-wafer Hybrid bonding
We utilize cutting-edge techniques such as 3D imaging microscopy, temporal-mode interferometry, spectral-interferometry, Doppler-Darkfield and Deflectometry across various wavelengths.
These technologies provide highly accurate and repeatable wafer measurements, enabling precise control of wafers & chips dimensions, and/or defect detection. Detectable defect types include frontside defects, backside defects & edge defects down to nanometer-scales on a variety of wafer types including: Silicon, GaN-on-Si, GaAs, InP, Sapphire, Glass, SiC.
Capabilities
Our technologies integrate innovative technical approaches, together with high-quality optics and world class software/algorithms to achieve precise measurements & detection of a wide variety of killer defect types.
Our ability to control and measure light and understand its interactions with various semiconductor industry materials is the area in which we excels.
Innovations For Tomorrow
We are dedicated to continuously advancing our Metrology and Inspection technologies via novel physics-based techniques.
Progress in these areas will enhance our customers' control over their manufacturing processes and support innovations in novel materials.
By collaborating closely with our customers to improve their yields, we lower their costs, whilst simultaneously reducing their environmental impact by reducing the number of scrapped wafers & chips.
Contact Us
Interested in working together? Get in touch to learn more.
Services and Support
Our comprehensive offerings include system upgrades, tool relocation, and certification for maintenance personnel, ensuring optimal uptime and efficiency.
Partner with us for reliable support and exceptional service. Get in touch with our Team.
Commitment to accelerating innovation in close collaboration with our customers & partners